Founded in January 1980, Lam Research is headquartered in Fremont, California, USA, stock code: NASDAQ: LRCX.

From mobile phones and computing devices to entertainment systems and increasingly "smart" cars, advanced microchips are found in many common products used in daily life. Electronics are everywhere, and life without them is unimaginable. Production of these tiny and complex device chips requires hundreds of separate steps, including a series of core process flows that are repeatedly executed. In order to carry out smooth production, semiconductor manufacturers need precise process flow and manufacturing equipment. Panlin Group works closely with its customers to provide them with the products and technologies they need to help them succeed. By providing key chip processing capabilities, Panlin Group's products have become an important link for manufacturers to realize new electronic equipment design.

The market demand for faster, smaller, and more powerful low-power electronic devices is driving new manufacturing strategies to enable the manufacture of advanced devices with sophisticated compact packaging components and complex 3D structures. It is no easy task to produce the cutting-edge microprocessors, memory devices and numerous other products that today's market requires, and continuous innovation and powerful machining solutions are needed.

By collaborating and leveraging expertise in multiple fields, Panlin Group continues to develop new capabilities to meet the production needs of these increasingly complex devices. Panlin Group’s innovative technology and productivity solutions cover transistors, interconnects, graphics, advanced memory, packaging, sensors, analog and mixed signals, discrete components and power devices, and optoelectronics and photonic devices, providing a wide range of Silicon wafer processing capability meets the production needs of new chips and applications.

The semiconductor process used to make today's advanced chips faces serious challenges and requires pushing the boundaries between physics and chemistry, using nanoscale components, new materials and increasingly complex 3D structures. To meet the ever-changing manufacturing needs in new chip designs, precision control is required at the atomic scale.

To ensure that these new process technologies are already available for production when chips enter fabs, scientists and engineers from Panlin Group are well aware of customers' production needs. Panlin Group offers a market-leading product portfolio for thin film deposition, plasma etching, photoresist degluing and wafer cleaning, which are complementary processing steps used throughout the semiconductor manufacturing process. To support advanced process monitoring and critical step control, Panlin Group’s product portfolio includes a range of high-precision mass measurement systems.