Hangzhou Shilan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. It is a high-tech enterprise specializing in the design of integrated circuit chips and the production of semiconductor microelectronics-related products. The company was founded in September 1997 and is headquartered in Hangzhou, China. In March 2003, the company's stock was listed on the Shanghai Stock Exchange. Thanks to the rapid development of China's electronic information industry, Shilan Microelectronics has become a large-scale integration in China. One of the companies that integrates circuit chip design and manufacturing (IDM), its technical level, business scale, profitability and other indicators are at the forefront among their domestic peers.

The integrated circuit chip production line built by Shilan Microelectronics in Qiantang New District, Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in chip manufacturing capacity less than and equal to 6 inches. The company's 8-inch production line was put into production in 2017, becoming the earliest private IDM product company in China to have an 8-inch production line. The monthly production capacity of the 8-inch line has reached 60,000 pieces. By the end of 2022, the company's 12-inch special process wafer production line has a monthly production capacity of 60,000 pieces, and the advanced compound semiconductor manufacturing production line has a monthly production capacity of 140,000 pieces.

The company's technology and products cover many fields of consumer products and maintain the forefront of the country in many technical fields, such as green power chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage intelligent power module technology, third Power semiconductor device technology, digital audio and video technology, etc. At the same time, using the company's accumulation in multiple chip design fields, we provide customers with targeted chip product series and systematic application solutions.

The company's current product and R&D investment is mainly concentrated in the following five areas:

1. Power semiconductor & semiconductor compound devices: including various power devices, PIM modules, Si-based GaN power devices, SiC devices, etc.

2. Power drive and control system: including AC-DC (first/secondary controllers suitable for various topologies, and power factor control) ; DC-DC, LED driver chips (automatic lighting - headlights, taillights, etc. , general lighting, intelligent lighting) ; IPM module, gate driver, isolation driver, motor driver chip ; SoC and MCU chip (variable frequency drive, system master control, human-computer interface) ; digital power chip (fast charging, PoE), etc.

3. MEMS sensor: including consumer-grade sensors (three-axis accelerometer, six-axis IMU unit, bone conduction accelerometer); automotive sensors (collision, IMU unit, vibration detection sensor) ; heart rate, blood oxygen, ALS/RGB/PS Sensor ; microphone, temperature and humidity, current, MEMS micromirror sensor, etc.

4. ASIC products: including signal chain (logic & level conversion, switching circuit, amplifier & comparator, isolation circuit, interface), power management (linear voltage regulator circuit, bipolar DCDC voltage regulator circuit, bipolar PWM controller, Darlington drive circuit, reference circuit), etc.

5. Optoelectronic products: including special lighting (plant lighting, infrared fill light beads, ceramic high-power lamp beads), automotive lighting (headlights, signal lights, interior lamps), optocouplers (high-speed optocouplers, driving optocouplers , photorelay), display chip and module (indoor TOP lamp beads, outdoor TOP lamp beads, indoor CHIP lamp beads), etc.