Changdian Technology is a world-leading integrated circuit manufacturing and technical service provider, providing a multi-faceted one-stop service for chip manufacturing, including integrated circuit system integration, design simulation, technology development, product certification, wafer testing, and crystal. Round-level middle-channel packaging testing, system-level packaging testing, chip finished product testing and can provide direct transportation services to semiconductor customers around the world.

Changdian Technology's products, services and technologies cover high-integration wafer-level packaging (WLP), 2.5D/3D packaging, system-level packaging (SiP), high-performance flip chip packaging and advanced wire bonding technology. It has applied mainstream integrated circuit systems, including network communication, mobile terminals, high-performance computing, vehicle electronics, big data storage, artificial intelligence and the Internet of Things, industrial intelligent manufacturing and other fields.

Changdian Technology has more than 23,000 employees around the world, has six production bases and two R&D centers in China, South Korea and Singapore, and has business organizations in more than 20 countries and regions, which can conduct close technical cooperation with global customers. And provide industrial chain support.