Hebei Zhongci Electronic Technology Co., Ltd. was established in 2009; the company is a high-tech enterprise specializing in the research, development, production and sales of electronic ceramic series products. It is committed to becoming a world-class electronic ceramic product supplier and providing customers with innovative and high-quality , competitive electronic ceramic products.

The company's main products include optical communication device shell, wireless power device shell, infrared detector shell, high-power laser shell, soundmeter crystal oscillator shell, 3D optical sensor module shell, 5G communication terminal module shell, aluminum nitride ceramic substrate, ceramic components , integrated heaters, etc., are widely used in optical communication, wireless communication, industrial laser, consumer electronics, automotive electronics and other fields. The company's electronic ceramic shell products are an important bridge for connecting internal chips and external circuits in high-end semiconductor components, and play an important role and influence on the performance of semiconductor components.

The company's technical advantages are mainly reflected in new electronic ceramic materials, semiconductor shell simulation design, production processes, etc.

In terms of materials, the company independently masters three ceramic systems, including 90% alumina ceramic, 95% alumina ceramic and aluminum nitride ceramic, and a metallization system that matches them.

In terms of design, the company has advanced design methods and design software platform, which can optimize the design of ceramic shell structure, wiring, electrical, thermal, reliability, etc. The company can design and develop a 400G optical communication device shell, which is comparable to similar foreign products' technical level; it has the thermodynamic reliability simulation capability of ceramic materials such as alumina and aluminum nitride and new metal seals, meeting the heat dissipation of the new generation of wireless power device shells and Reliability requirements; realize the design of airtight and high lead strength, and the developed high-end fiber-coupled semiconductor laser package housing meets user requirements.

In terms of process technology, the company has a complete set of multi-layer ceramic shell manufacturing technologies, including raw material preparation, casting, punching cavity, metallization printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating and other technologies. The company has established a complete alumina ceramic and aluminum nitride ceramic processing technology platform, with alumina multi-layer ceramic technology mainly for casting, high-temperature thick film metallization technology mainly for thick film printing, and high-temperature solder. The main brazing assembly process and nickel plating and gold plating processes mainly based on electroplating and electrochemical plating.