CAPCON
CAPCON
Capcon Limited, founded in 2014, is a high-end equipment manufacturer focusing on the field of advanced packaging equipment. Dedicated to providing customers with advanced semiconductor packaging product technologies and solutions. Currently, it has branches in Singapore, Taiwan, the Philippines, Beijing and other places.
The group company has a globally leading founding team and product technology in the field of advanced packaging equipment, and its mature equipment product line has been recognized by internationally renowned semiconductor packaging and testing manufacturers. Customers serving include TSMC, Sun and Moonlight, Silicon Products, Electric Power Technology, Tongfu Microelectronics, DeeTee, etc. The group company's products have achieved comprehensive coverage of advanced packaging and patch technology, including FOWLP (Face Up/Down), POP, MCM, EMCP, Stack Die, SIP, 2.5D/3D, FCCSP, FCBGA, etc.
The group company is positioned in the field of advanced semiconductor packaging, providing a new generation of semiconductor installation and packaging equipment for semiconductor rear processes, such as flip-Chip Bonder and wafer-level chip machine (Chip-on-Wafer Bonder). ), POP packaging machine (Package-on-Package Bonder), stacked semi-patch machine (Stack Die Bonder), panel-level chip machine (Panel-Level Die Bonder), multi-chip chip machine (Multi-Chip Die Bonder) wait.
The main products of the group company are characterized by high precision, high speed and high stability. The modular customization of products can flexibly meet customer customization needs. We also adhere to the customer as the core, provide customers with high-quality after-sales service, respond quickly to the needs of the factory service, and solve customers' worries.
